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| WL1837MOD藍牙和Wi－Fi無線模塊解決方案 |
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| 文章來源： 更新時間：2014/11/24 9:47:00 |
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TI公司的WL1837MOD是雙頻帶(2.4GHz和5GHz)Wi-Fi模塊解決方案,具有兩個天線,符合FCC, IC,ETSI/CE和TELEC標準,操作系統包括Linux®, Android™, WinCE和RTOS.器件集成了RF,功率放大器,時鐘,RF開關,濾波器,無源元件和電源.Wi-Fi部分支持IEEE Std 802.11a, 802.11b,802.11g和802.11n標準,藍牙支持Bluetooth 4.1和CSA2,工作溫度–40℃到85℃,主要用在物聯網,多媒體,家用電子,家用電器和白色家電,工業和家庭自動化,智能網關,視頻會議,視頻相機等.本文介紹了WL1837MOD主要特性和優勢,功能框圖,系統應用框圖,參考電路和材料清單,以及評估板WL1837MODCOM8I EVB主要特性,電路圖,材料清單和四層PCB設計圖.
The certified WiLink 8 module from TI offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting Industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.
WL1837MOD主要特性和優勢:
General
Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power
Management
Quick Hardware Design With TI Module
Collateral and Reference Designs
Operating Temperature: –40℃ to 85℃
Industrial Temperature Grade
Small Form Factor: 13.3 × 13.4 × 2 mm
100-Pin MOC Package
FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
Wi-Fi
WLAN Baseband Processor and RF Transceiver
Support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
20- and 40-MHz SISO and 20-MHz 2 x 2 MIMO
at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
2.4-GHz MRC Support for Extended Range and 5-GHz Diversity Capable
Fully Calibrated: Production Calibration Not Required
4-Bit SDIO Host Interface Support
Wi-Fi Direct Concurrent Operation (Multichannel, Multirole)
Bluetooth and BLE (WL1837MOD Only)
Bluetooth 4.1 and CSA2 Support
Host Controller Interface (HCI) Transport for Bluetooth Over UART
Dedicated Audio Processor Support of SBC Encoding + A2DP
Dual-Mode Bluetooth and BLE
Bluetopia + LE Certified Stack Provided by TI
Key Benefits
Reduces Design Overhead
Differentiated Use-Cases by Configuring WiLink
8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks)
Best-in-Class Wi-Fi With High-Performance
Audio and Video Streaming Reference
Applications With Up to 1.4X the Range Versus a Single Antenna
Different Provisioning Methods for In-Home
Devices Connectivity to Wi-Fi in One Step
Lowest Wi-Fi Power Consumption in Connected
Idle (< 800 µA)
Configurable Wake on WLAN Filters to Only
Wake Up the System
Wi-Fi-Bluetooth Single Antenna Coexistence
圖1. WL1837MOD功能框圖
WL1837MOD主要應用:
Internet of Things
Multimedia
Home Electronics
Home Appliances and White Goods
Industrial and Home Automation
Smart Gateway and Metering
Video Conferencing
Video Camera and Security
圖2. WL1837MOD系統應用框圖
圖3. WL1837MOD模塊參考電路
WL1837MOD模塊材料清單:
評估板WL1837MODCOM8I EVB
2.4 & 5 GHz Dual Band Wi-Fi® + Bluetooth® Certified Antenna Design on WiLink™ 1837 Module
The WL1837MODCOM8I is a Wi-Fi® dual-band, Bluetooth, and BLE module evaluation board (EVB) with the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a poweroptimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.TI.
The WiLink 1837 module antenna design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it’s been certified. Through this, customers are able to evaluate the performance of the module through embedded applications such as home automation and the Internet of Things that make use of both embedded Wi-Fi and Bluetooth / Bluetooth low energy functionalities found on the WiLink 1837 module. This antenna design leverages the use of its certification by using the same layout when the module was tested for certification, allowing customers to avoid repeated certification when creating their applications.
評估板WL1837MODCOM8I EVB主要特性:
• WLAN, Bluetooth, and BLE on a single module board
• 100-pin board card
• Dimensions: 76.0 mm (L) x 31.0 mm (W)
• WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
• Support for BLE dual mode
• Seamless integration with TI Sitara and other application processors
• Design for the TI AM335X general-purpose evaluation module (EVM)
• WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior WL127x, WL128x, and BL6450 offerings for smooth migration to device
• Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for WLAN
• Wi-Fi and Bluetooth single-antenna coexistence
• Built-in chip antenna
• Optional U.FL RF connector for external antenna
• Direct connection to the battery using an external switched-mode power supply (SMPS) supporting 2.9- to 4.8-V operation
• VIO in the 1.8-V domain
評估板WL1837MODCOM8I EVB主要優勢:
• Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth
• WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
• Bluetooth 4.1 + BLE (Smart Ready)
• Wi-Fi and Bluetooth single-antenna coexistence
• Low power at 30% to 50% less than the previous generation
• Available as an easy-to-use FCC-, ETSI-, and Telec-certified module
• Lower manufacturing costs saves board space and minimizes RF expertise.
• AM335x Linux and Android reference platform accelerates customer development and time to market.
評估板WL1837MODCOM8I EVB應用:
• Portable consumer devices
• Home electronics
• Home appliances and white goods
• Industrial and home automation
• Smart gateway and metering
• Video conferencing
• Video camera and security
圖4. 評估板WL1837MODCOM8I EVB外形圖
圖5. 評估板WL1837MODCOM8I EVB PCB元件布局圖
圖6. 評估板WL1837MODCOM8I EVB 電路圖
評估板WL1837MODCOM8I EVB材料清單:
圖7. 評估板WL1837MODCOM8I EVB PCB設計圖:層1
圖8. 評估板WL1837MODCOM8I EVB PCB設計圖:層2
圖9. 評估板WL1837MODCOM8I EVB PCB設計圖:層3
圖10. 評估板WL1837MODCOM8I EVB PCB設計圖:層4 |
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